Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)
NORM herausgegeben am 1.9.2009
Bezeichnung normen: ASTM B579-73(2009)
Anmerkung: UNGÜLTIG
Ausgabedatum normen: 1.9.2009
Zahl der Seiten: 5
Gewicht ca.: 15 g (0.03 Pfund)
Land: Amerikanische technische Norm
Kategorie: Technische Normen ASTM
Keywords:
electrodeposited coatings, tin-lead alloy (solder plate), solder, tin-lead alloy, tin-lead, Artificial aging, Bend testing--coatings, Burnishing test--for coating adhesion, Coating adhesion--electrodeposited coatings, Copper alloy electrodeposited coatings, Dip test, Electrodeposited Sn coatings--specifications, Globule test, Iron products (general)--electrodeposited coatings, Lead-tin alloys/coatings--specifications, Printed circuits, Quenching, Reflow test