Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

Informationen über die Norm:

Bezeichnung normen: ASTM D5109-12
Anmerkung: UNGÜLTIG
Ausgabedatum normen: 1.11.2012
Zahl der Seiten: 9
Gewicht ca.: 27 g (0.06 Pfund)
Land: Amerikanische technische Norm
Kategorie: Technische Normen ASTM

Die Annotation des Normtextes ASTM D5109-12 :

Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)