
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
NORM herausgegeben am 1.3.2018
    
        Designation standards: ASTM F459-13(2018)
                
                
                
                Note:    UNGÜLTIG
               
                Publication date standards:  1.3.2018
        The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
        Country:          American technical standard
        Kategorie: Technische Normen ASTM
        
                
              
Keywords:
microelectronic wire bonds, pull strength, wire bonds,, ICS Number Code 29.120.20 (Connecting devices)