Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
NORM herausgegeben am 1.5.2007
Designation standards: ASTM F542-07
Note: UNGÜLTIG
Publication date standards: 1.5.2007
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Kategorie: Technische Normen ASTM
Keywords:
electronic, encapsulating compounds, exothermic temperature, microelectronic encapsulation, ICS Number Code 31.240 (Mechanical structures for electronic equipment)