Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
NORM herausgegeben am 1.3.2004
Designation standards: ASTM F677-04
Note: UNGÜLTIG
Publication date standards: 1.3.2004
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Kategorie: Technische Normen ASTM
Keywords:
electronic, encapsulating compound, grease, microelectronics