
Standard Specification for Gold Wire for Semiconductor Lead Bonding
NORM herausgegeben am 1.4.2024
Bezeichnung normen: ASTM F72-24
Ausgabedatum normen: 1.4.2024
Zahl der Seiten: 11
Gewicht ca.: 33 g (0.07 Pfund)
Land: Amerikanische technische Norm
Kategorie: Technische Normen ASTM
This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.