Standard Specification for Gold Wire for Semiconductor Lead Bonding
NORM herausgegeben am 1.1.2001
Designation standards: ASTM F72-95
Note: UNGÜLTIG
Publication date standards: 1.1.2001
The number of pages: 13
Approximate weight : 39 g (0.09 lbs)
Country: American technical standard
Kategorie: Technische Normen ASTM
Keywords:
gold wire, semiconductor, internal, electrical connections, copper-modified wire, beryllium-modified wire, high-strength wire, special purpose wire, lead bonding, thermal stability, high purity gold wire