Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)
NORM herausgegeben am 1.1.2006
Designation standards: ASTM F72-06
Note: UNGÜLTIG
Publication date standards: 1.1.2006
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: American technical standard
Kategorie: Technische Normen ASTM
Keywords:
gold wire, semiconductor, internal, electrical connections, copper-modified wire, beryllium-modified wire, high-strength wire, special purpose wire, lead bonding, thermal stability, high purity gold wire, ICS Number Code 29.060.10 (Wires)