BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.

NORM herausgegeben am 28.3.2018

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The information about the standard:

Designation standards: BS EN IEC 61190-1-3:2018
Publication date standards: 28.3.2018
The number of pages: 50
Approximate weight : 150 g (0.33 lbs)
Country: British technical standard
Kategorie: Technische Normen BS

Annotation of standard text BS EN IEC 61190-1-3:2018 :

ISBN: 978 0 580 89238 7 Status: Under Review