Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
NORM herausgegeben am 1.8.2025
Bezeichnung normen: ČSN EN IEC 62878-2-603
Zeichen: 359378
Katalog-Nummer: 521881
Ausgabedatum normen: 1.8.2025
Zahl der Seiten: 24
Gewicht ca.: 72 g (0.16 Pfund)
Land: Tschechische technische Norm
Kategorie: Technische Normen ČSN
This part of IEC 62878 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM)