Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity
NORM herausgegeben am 1.1.2022
Bezeichnung normen: ČSN EN IEC 62878-2-602
Zeichen: 359378
Katalog-Nummer: 513471
Ausgabedatum normen: 1.1.2022
Zahl der Seiten: 24
Gewicht ca.: 72 g (0.16 Pfund)
Land: Tschechische technische Norm
Kategorie: Technische Normen ČSN
High-end servers, network systems and smart phones have been driving the electronic assembly technologies for the last couple of decades. Any applications to enable the "Internet of Things" (aka IoT) require new electronic assembly technologies to achieve small size, low energy consumption and robust security in a cost-effective way. This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules