DIN EN 60191-6-4:2004-01

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA).

NORM herausgegeben am 1.1.2004

The information about the standard:

Designation standards: DIN EN 60191-6-4:2004-01
Publication date standards: 1.1.2004
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Kategorie: Technische Normen DIN