E DIN IEC 60191-6-21:2009-02

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).

NORM herausgegeben am 1.2.2009

The information about the standard:

Designation standards: E DIN IEC 60191-6-21:2009-02
Note: UNGÜLTIG
Publication date standards: 1.2.2009
The number of pages: 30
Approximate weight : 90 g (0.20 lbs)
Country: German technical standard
Kategorie: Technische Normen DIN