Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
NORM herausgegeben am 23.5.2023
Designation standards: GB/T 15879.604-2023
Publication date standards: 23.5.2023
Country: Chinese technical standard
Kategorie: Technische Normen GB