GB/T 43536.2-2023

Three dimensional integrated circuits—Part 2Alignment of stacked dies having fine pitch interconnect

NORM herausgegeben am 28.12.2023

The information about the standard:

Designation standards: GB/T 43536.2-2023
Publication date standards: 28.12.2023
Country: Chinese technical standard
Kategorie: Technische Normen GB