GB/T 44791-2024

Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation

NORM herausgegeben am 26.10.2024

English, Chinesisch -
Elektronische PDF (277.20 EUR)

The information about the standard:

Designation standards: GB/T 44791-2024
Publication date standards: 26.10.2024
Country: Chinese technical standard
Kategorie: Technische Normen GB