
Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
NORM herausgegeben am 30.4.2026
Designation standards: GB/T 4937.201-2026
Note: Execute Date: november 2026
Publication date standards: 30.4.2026
Country: Chinese technical standard
Kategorie: Technische Normen GB