GB/T 4937.22-2018

Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength

NORM herausgegeben am 17.9.2018

The information about the standard:

Designation standards: GB/T 4937.22-2018
Publication date standards: 17.9.2018
Country: Chinese technical standard
Kategorie: Technische Normen GB