Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
NORM herausgegeben am 30.10.2001
Bezeichnung normen: IEC 60191-6-1-ed.1.0
Ausgabedatum normen: 30.10.2001
Zahl der Seiten: 7
Gewicht ca.: 21 g (0.05 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen IEC
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)