Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
NORM herausgegeben am 28.7.2010
Designation standards: IEC 60191-6-18-ed.1.0/Cor.2
Note: Korrektur
Publication date standards: 28.7.2010
The number of pages: 1
Approximate weight : 3 g (0.01 lbs)
Country: International technical standard
Kategorie: Technische Normen IEC