IEC 60191-6-2-ed.1.0/Cor.1

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

NORM herausgegeben am 18.10.2002

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The information about the standard:

Designation standards: IEC 60191-6-2-ed.1.0/Cor.1
Note: Korrektur
Publication date standards: 18.10.2002
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Kategorie: Technische Normen IEC