Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
NORM herausgegeben am 30.8.2010
Designation standards: IEC 60191-6-21-ed.1.0
Publication date standards: 30.8.2010
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: International technical standard
Kategorie: Technische Normen IEC
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4. La CEI 60191-6-21:2010 specifie les methodes destinees a mesurer les dimensions des boitiers de faible encombrement SOP, lencombrement des boitiers de forme E conformement a la CEI 60191-4.