Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
NORM herausgegeben am 27.8.2001
Bezeichnung normen: IEC 60191-6-5-ed.1.0
Ausgabedatum normen: 27.8.2001
Zahl der Seiten: 10
Gewicht ca.: 30 g (0.07 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen IEC
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.