Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Informationen über die Norm:

Bezeichnung normen: IEC 60749-20-ed.3.0
Ausgabedatum normen: 31.8.2020
Zahl der Seiten: 55
Gewicht ca.: 165 g (0.36 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen IEC

Die Annotation des Normtextes IEC 60749-20-ed.3.0 :

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes. L’IEC 60749-20:2020 fournit des moyens d’evaluer la resistance a la chaleur de brasage des semiconducteurs sous emballage comme les composants a boitier plastique pour montage en surface (CMS). Cet essai est destructif. Cette edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente: - incorporation d’un corrigendum de l’IEC 60749-20:2008 (deuxieme edition), - inclusion d’un nouvel Article 3, - inclusion de notes explicatives.