Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
NORM herausgegeben am 20.1.2017
Bezeichnung normen: IEC 62047-27-ed.1.0
Ausgabedatum normen: 20.1.2017
Zahl der Seiten: 16
Gewicht ca.: 48 g (0.11 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen IEC
IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries. The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.