Format for LSI-Package-Board Interoperable design
NORM herausgegeben am 11.10.2023
Bezeichnung normen: IEC 63055-ed.2.0
Ausgabedatum normen: 11.10.2023
Zahl der Seiten: 292
Gewicht ca.: 907 g (2.00 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen IEC
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.