
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 5: Test method for defects using X-ray topography
NORM herausgegeben am 6.10.2026
Bezeichnung normen: IEC 63068-5-ed.1.0
Ausgabedatum normen: 6.10.2026
Zahl der Seiten: 31
Gewicht ca.: 93 g (0.21 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen IEC
IEC 63068-5:2026 provides definitions and guidance in use of X-ray topography inspection system for detecting defects in silicon carbide (SiC) homoepitaxial wafers. Additionally, this document exemplifies X-ray topographic images to enable the detection and categorization of defects in SiC homoepitaxial wafers.