Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
NORM herausgegeben am 26.6.2019
Designation standards: IEC/TR 61189-5-506-ed.1.0
Publication date standards: 26.6.2019
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Kategorie: Technische Normen IEC
IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.