IEC/TR 61760-3-1-ed.1.0

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

NORM herausgegeben am 17.6.2022

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The information about the standard:

Designation standards: IEC/TR 61760-3-1-ed.1.0
Publication date standards: 17.6.2022
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: International technical standard
Kategorie: Technische Normen IEC

Annotation of standard text IEC/TR 61760-3-1-ed.1.0 :

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.