IEC/TR 62878-2-7-ed.1.0

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

NORM herausgegeben am 20.3.2019

Englisch -
Elektronische PDF (103.10 EUR)

Englisch -

Gedruckt (103.10 EUR)

Englisch -

CD-ROM (104.70 EUR)

The information about the standard:

Designation standards: IEC/TR 62878-2-7-ed.1.0
Publication date standards: 20.3.2019
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: International technical standard
Kategorie: Technische Normen IEC

Annotation of standard text IEC/TR 62878-2-7-ed.1.0 :

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.