JIS C5630-18:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials

NORM herausgegeben am 22.12.2014

The information about the standard:

Designation standards: JIS C5630-18:2014
Publication date standards: 22.12.2014
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: Other standards
Kategorie: Technische Normen JIS