Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
NORM herausgegeben am 22.8.2022
Designation standards: JIS C61760-3:2022
Publication date standards: 22.8.2022
The number of pages: 44
Approximate weight : 132 g (0.29 lbs)
Country: Other standards
Kategorie: Technische Normen JIS