
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
NORM herausgegeben am 1.1.2022
Designation standards: STN EN IEC 61189-2-807
Classification mark: 346513
Catalog number: 134069
Publication date standards: 1.1.2022
Approximate weight : 30 g (0.07 lbs)
Country: Slovak technical standard
Kategorie: Technische Normen STN