Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
NORM herausgegeben am 1.7.2021
Designation standards: STN EN IEC 61189-5-601
Classification mark: 346513
Catalog number: 132888
Publication date standards: 1.7.2021
Approximate weight : 48 g (0.11 lbs)
Country: Slovak technical standard
Kategorie: Technische Normen STN