Thermal standardization on semiconductor packages -- Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points (IEC 47D/991/CDV) (english version)
NORM herausgegeben am 1.7.2025
Designation standards: E ÖVE EN IEC 63378-6
Publication date standards: 1.7.2025
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: Austrian technische Norm
Kategorie: Technische Normen ÖNORM