Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation
NORM herausgegeben am 18.12.2018
Bezeichnung normen: ISO/TS 10303-1689:2018-ed.5.0
Ausgabedatum normen: 18.12.2018
Gewicht ca.: 300 g (0.66 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen ISO
Description / Abstract: ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation. The following are within the scope of ISO/TS 10303-1689:2018-11: thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.