Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points (Endorsed by Asociación Espanola de Normalización in May of 2026.)
NORM herausgegeben am 1.5.2026
Designation standards: UNE-EN IEC 63378-6:2026
Publication date standards: 1.5.2026
The number of pages: 30
Approximate weight : 90 g (0.20 lbs)
Country: Spanish technical standard
Kategorie: Technische Normen UNE