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Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
Automatische name übersetzung:
Standard Test Method for radiologischen Untersuchung von Halbleiter und elektronische Bauelemente
NORM herausgegeben am 10.6.2003
Bezeichnung normen: ASTM E1161-03
Anmerkung: UNGÜLTIG
Ausgabedatum normen: 10.6.2003
SKU: NS-40673
Zahl der Seiten: 4
Gewicht ca.: 12 g (0.03 Pfund)
Land: Amerikanische technische Norm
Kategorie: Technische Normen ASTM
Keywords:
electronic devices, nondestructive testing, radiographic, radioscopy, semiconductors, X-Ray
| Significance and Use | ||||||||||||||||||||||||||||||||||||||||||
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This test method is useful for determination of voiding in semiconductor element to header mounting material, glass seal, and lid seal areas. It is also useful for examination of the internal cavities of devices for extraneous material, wire dress, and bond placement for unattached elements. |
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| 1. Scope | ||||||||||||||||||||||||||||||||||||||||||
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1.1 This test method provides a standard procedure for nondestructive radiographic examination of semiconductor devices, electronic components, and the materials used for construction of these items. This test method covers the radiographic examination of these items for possible defective conditions such as extraneous material within the sealed case, improper internal connections, voids in materials used for element mounting, or the sealing glass, or physical damage. 1.2 The quality level and acceptance criteria for the specimens being examined shall be specified in the detail drawing, purchase order or contract. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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| 2. Referenced Documents | ||||||||||||||||||||||||||||||||||||||||||
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