Standard Practice for Radiographic Examination of Semiconductors and Electronic ComponentsName übersetzen
NORM herausgegeben am 1.6.2021
Bezeichnung normen: ASTM E1161-21
Ausgabedatum normen: 1.6.2021
Zahl der Seiten: 11
Gewicht ca.: 33 g (0.07 Pfund)
Land: Amerikanische technische Norm
Kategorie: Technische Normen ASTM
capacitor, diode, electronic device, hybrid, inductor, microcircuits, microcircuit array, monolithic, multichip, nondestructive testing, radiographic, radiologic, radiology, radioscopy, rectifier, relay, resistor, semiconductor, switches, transformer, transistor, tunnel diode, voltage regulator, X-ray,, ICS Number Code 31.080.01 (Semi-conductor devices in general)
|Significance and Use|
4.1This practice establishes the basic minimum parameters and controls for the application of radiographic examination of electronic devices. Factors such as device handling, equipment, ESDS, materials, personnel qualification, procedure and quality requirements, reporting, records and radiation sensitivity are addressed. This practice is written so it can be specified on the engineering drawing, specification, or contract. It is not a detailed how-to procedure and must be supplemented by a detailed examination technique/procedure (see ).
4.2This practice does not set limits on radiation dose but does list requirements to limit and document radiation dose to devices. When radiation dose limits are an issue, the requestor of radiographic examinations must be cognizant of this issue and state any maximum radiation dose limitations that are required in the contractual agreement between the using parties.
1.1This practice provides the minimum requirements for nondestructive radiographic examination of semiconductor devices, microelectronic devices, electromagnetic devices, electronic and electrical devices, and the materials used for construction of these items.
1.2This practice covers the radiographic examination of these items to detect possible defective conditions within the sealed case, especially those resulting from sealing the lid to the case, and internal defects such as extraneous material (foreign objects), improper interconnecting wires, voids in the die attach material or in the glass (when sealing glass is used), solder defects, or physical damage.
1.3Basis of ApplicationThere are areas in this practice that may require agreement between the cognizant engineering organization and the supplier, or specific direction from the cognizant engineering organization. These items should be addressed in the purchase order, contract, or inspection technique. Specific applications may require adherence to this practice in part or in full. Deviations from this practice shall be enumerated in inspection plan and approved by both cognizant engineering organization and supplier.
1.4UnitsThe values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this practice.
1.5This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.6This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
|2. Referenced Documents|
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