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IEC 60749-37-ed.2.0-RLV
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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NORM herausgegeben am 12.10.2022
Informationen über die Norm:
Bezeichnung normen: IEC 60749-37-ed.2.0-RLV
Ausgabedatum normen: 12.10.2022
SKU: NS-1094760
Zahl der Seiten: 67
Gewicht ca.: 201 g (0.44 Pfund)
Land: Internationale technische Norm
Kategorie: Technische Normen IEC
Kategorie - ähnliche Normen:
Die Annotation des Normtextes IEC 60749-37-ed.2.0-RLV :
IEC 60749-37:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology.
