Test procedure for the determination of the temperature index of enamelled winding wires.

UNGÜLTIG herausgegeben am 31.5.2010

Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires.

UNGÜLTIG herausgegeben am 31.7.2015

Tracked Changes. Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires.

UNGÜLTIG herausgegeben am 26.2.2020

Method of test for accuracy and precision of mechanical handpipettes down to 0.05 ml capacity.

UNGÜLTIG herausgegeben am 30.9.1987

Method of test for accuracy and precision of mechanical handpipettes of capacity 0.05 mL and above.

UNGÜLTIG herausgegeben am 20.12.1991

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices.

UNGÜLTIG herausgegeben am 29.6.2007

Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages.

UNGÜLTIG herausgegeben am 19.2.2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch land grid array (FLGA). Rectangular type.

UNGÜLTIG herausgegeben am 24.9.2002

Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA).

UNGÜLTIG herausgegeben am 31.1.2008

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

UNGÜLTIG herausgegeben am 18.2.2005