Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

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Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.

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Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

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Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

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Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in March of 2005.)

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LOW PRESSURE SODIUM VAPOUR LAMPS.

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Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests.

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ALUMINIUM AND ALUMINIUM ALLOYS. WROUGHT PRODUCTS. CHEMICAL COMPOSITION OF SEMI PRODUCTS USED FOR THE FABRICATION OF ARTICLES FOR USE IN CONTACT WITH FOOD.

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SAFETY OF MACHINERY. ELECTRICAL EQUIPMENT OF MACHINES. PART 1: GENERAL REQUIREMENTS.

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SAFETY OF MACHINERY. ELECTRICAL EQUIPMENT OF MACHINES. PART 1: GENERAL REQUIREMENTS.

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