General specification for trunked mobile communication system

Die Norm herausgegeben am 22.12.1995

General specification for leaky cable radiocommunication system

Die Norm herausgegeben am 22.12.1995

Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package

Die Norm herausgegeben am 15.5.2015

Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

Die Norm herausgegeben am 31.12.2013

Semiconductor integrated circuits—Specification of leadframes for small outline package

Die Norm herausgegeben am 15.5.2015

Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Die Norm herausgegeben am 30.8.2019

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Die Norm herausgegeben am 17.9.2018

Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
Execute Date: february 2027

Die Norm herausgegeben am 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Die Norm herausgegeben am 23.5.2023

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

Die Norm herausgegeben am 31.12.2025