Mechanical standardization of semiconductor devices—Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Execute Date: march 2027

Die Norm herausgegeben am 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Execute Date: march 2027

Die Norm herausgegeben am 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)
Execute Date: february 2027

Die Norm herausgegeben am 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of small outline J-lead packages SOJ
Execute Date: february 2027

Die Norm herausgegeben am 30.7.2026

Medical glass thermometer

Die Norm herausgegeben am 29.4.2024

Potentiometers for use in electronic equipment--Part 3:Sectional specification--Rotary precision potentiometers

Die Norm herausgegeben am 22.12.1995

Potentiometers for use in electronic equipment--Part 3:Blank detail specification--Rotary precision potentiometers--Assessment level E

Die Norm herausgegeben am 22.12.1995

R.F. coaxial connectors type C

Die Norm herausgegeben am 22.12.1995

R.F. coaxial connectors type UHF

Die Norm herausgegeben am 22.12.1995

Limits of dimensions, axle load and masses for motor vehicles,trailers and combination vehicles

Die Norm herausgegeben am 26.7.2016