Printed boards and printed board assemblies. Design and use. Part 5-3. Attachment (land/joint) considerations. Components with gull-wing leads on two sides

Die Norm herausgegeben am 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-4. Attachment (land/joint) considerations. Components with J leads on two sides

Die Norm herausgegeben am 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-5. Attachment (land/joint) considerations. Components with gull-wing leads on four sides

Die Norm herausgegeben am 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-6. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides

Die Norm herausgegeben am 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-8. Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

Die Norm herausgegeben am 1.3.2015

Printed boards and printed boards assemblies. Design and use. Part 7. Electronic component zero orientation for CAD library construction

Die Norm herausgegeben am 1.7.2018

Test methods for electrical materials, interconnection structures and assemblies. Part 1. General test methods and methodology

Die Norm herausgegeben am 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 2. Test methods for materials for interconnection structures

Die Norm herausgegeben am 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 3. Test methods for interconnection structures (printed boards)

Die Norm herausgegeben am 1.3.2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-1. General test methods for materials and assemblies. Guidance for printed board assemblies

Die Norm herausgegeben am 1.6.2020