Normen STN - Slowakische nationale Normen - Seite Nr. 2445

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Die Norm herausgegeben am 1.12.2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Die Norm herausgegeben am 1.12.2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Die Norm herausgegeben am 1.12.2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

Die Norm herausgegeben am 1.8.2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Die Norm herausgegeben am 1.1.2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

Die Norm herausgegeben am 1.8.2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Die Norm herausgegeben am 1.5.2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Die Norm herausgegeben am 1.9.2008

Vulcanized fibre for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: Flat sheets

Die Norm herausgegeben am 1.9.2020

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Die Norm herausgegeben am 1.4.2026